Helicap is one of Asia's fastest-growing FinTech firms specialising in the private investments and alternative lending space in Asia Pacific. Powered by our proprietary credit analytics engine, we analyse and evaluate millions of data points from non-bank financial institutions and high-growth startups to extract meaningful investment insights and address a $740 billion market opportunity. We provide curated private debt and private equity investments with attractive risk-adjusted returns to a wide network of investors, including Family Offices, HNWIs, Impact Funds, and Institutional Investors. Through these investments, we aim to fill a financing gap and enable financial access for over 300 million underbanked companies and people in the region.
Helicap is based out of Singapore with subsidiaries licensed or registered with the Monetary Authority of Singapore (MAS): - Helicap Investments; RFMC registered with MAS - Helicap Securities; CMS License for Dealing in Securities by MAS. We have raised over $30 million and our investors include Temasek-backed Tikehau, Phillip Capital, Credit Saison, East Ventures, as well as senior executives from Temasek, GIC, Morgan Stanley, and Blackrock.
The internship spans from Dec-May (Spring), May-Aug( Summer), and Aug-Dec (Winter), with flexibility on the starting and ending dates. This includes a potential of conversion into a full-time position. Candidates will be given a stipend, meal allowances as well as transport allowance when required.
The internship is based in our Singapore office with a hybrid work-from-home arrangement.
We are looking for candidates who are ambitious, entrepreneurial, enjoy startup culture, do multiple tasks, and are willing to learn. Helicap is a fast-growing startup where every hire counts - Candidates must be willing to be flexible on job scope and take a long-term view. We want to hear from you if you've built a successful track record and enjoy working in a startup culture.
To apply, send a resume to firstname.lastname@example.org with the following details: